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FMI Model 555EU Eutectic Die Attach Machine is a high precision instrument
for assembling small components and particularly microelectronic semiconductor devices requiring low ohmic contact through
the eutectic process (<Gr<”Eutektos-<Eu-easy + melt) meaning “easily melted”. The machine is designed
to assemble devices that come in a variety of sizes and presentation formats. Piece parts are picked and placed from either
a rotating mirror or 2”X 2” Fluoroware chip carriers.
FMI Model 555EU Eutectic Die Bonder is an economical, robust and simple to operate
machine. The machine provides for single collet vacuum pick and place of die from waffle pack, Gel-Pak or bulk die media and
features adjustable and repeatable subsonic scrub. The custom work holder is
optional and can be ordered with the machine based on the application. The microscope, work area lighting, programmable temperature
controller and forming gas flow meter are standard and will provide easy solutions for R&D and small production requirements.
Model 555EU offers work sensing pure vertical motion and an 8:1 ratio platform that will provide the operator with a valuable
tool for repeatable results.
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